Lines Matching +full:on +full:- +full:device
1 # SPDX-License-Identifier: GPL-2.0-only
22 depends on NET
26 trip point crossed, cooling device update or governor
38 depends on DEBUG_FS
45 depends on DEBUG_FS
47 Say Y to add a debugfs-based thermal core testing facility.
53 int "Emergency poweroff delay in milli-seconds"
63 time for orderly_poweroff() to finish on regular execution.
70 prompt "Expose thermal sensors as hwmon device"
71 depends on HWMON=y || HWMON=THERMAL
84 prompt "APIs to parse thermal data out of device tree"
85 depends on OF
90 device tree blob.
93 based on device tree.
114 devices based on their 'contribution' to a zone. The
128 depends on THERMAL_GOV_POWER_ALLOCATOR
130 Select this if you want to control temperature based on
131 system and device power allocation. This governor can only
132 operate on cooling devices that implement the power API.
136 depends on THERMAL_GOV_BANG_BANG
145 bool "Fair-share thermal governor"
147 Enable this to manage platform thermals using fair-share governor.
162 used for fans without throttling. Some fan drivers depend on this
172 depends on ENERGY_MODEL
179 depends on THERMAL_OF
182 cooling device available, this option allows to use the CPU
183 as a cooling device.
188 bool "CPU frequency cooling device"
189 depends on CPU_FREQ
199 bool "CPU idle cooling device"
200 depends on IDLE_INJECT
208 bool "Generic device cooling support"
209 depends on PM_DEVFREQ
210 depends on PM_OPP
215 This will throttle the device by limiting the maximum allowed DVFS
218 In order to use the power extensions of the cooling device,
231 WARNING: Be careful while enabling this option on production systems,
237 depends on OF
238 depends on HAS_IOMEM
241 memory-mapped reads to get the temperature. Any HW/System that
242 allows temperature reading by a single memory-mapped reading, be it
248 depends on ARCH_HISI || COMPILE_TEST
249 depends on HAS_IOMEM
250 depends on OF
254 thermal framework. cpufreq is used as the cooling device to throttle
259 depends on ARCH_MXC || COMPILE_TEST
260 depends on NVMEM || !NVMEM
261 depends on MFD_SYSCON
262 depends on OF
264 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
266 cpufreq is used as the cooling device to throttle CPUs when the
271 depends on IMX_SCU
272 depends on OF
274 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
282 depends on ARCH_MXC || COMPILE_TEST
283 depends on OF
285 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
287 cpufreq is used as the cooling device to throttle CPUs when the passive
292 depends on ARCH_K3 || COMPILE_TEST
296 - AM654
302 depends on MFD_MAX77620
303 depends on OF
306 Semiconductor PMIC MAX77620 device. Device generates two alarm
312 depends on THERMAL_OF && HAS_IOMEM
313 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
316 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
318 cpufreq is used as the cooling device to throttle CPUs when the
323 depends on PLAT_SPEAR || COMPILE_TEST
324 depends on HAS_IOMEM
325 depends on OF
332 depends on ARCH_SUNXI || COMPILE_TEST
333 depends on HAS_IOMEM
334 depends on NVMEM
335 depends on OF
336 depends on RESET_CONTROLLER
342 module will be called sun8i-thermal.
346 depends on ARCH_ROCKCHIP || COMPILE_TEST
347 depends on RESET_CONTROLLER
348 depends on HAS_IOMEM
351 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
352 trip point. Cpufreq is used as the cooling device and will throttle
356 tristate "Temperature sensor on Marvell Kirkwood SoCs"
357 depends on MACH_KIRKWOOD || COMPILE_TEST
358 depends on HAS_IOMEM
359 depends on OF
365 tristate "Temperature sensor on Marvell Dove SoCs"
366 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
367 depends on HAS_IOMEM
368 depends on OF
375 depends on MFD_DB8500_PRCMU && OF
385 depends on ARCH_MVEBU || COMPILE_TEST
386 depends on HAS_IOMEM
387 depends on OF
394 depends on MFD_DA9062 || COMPILE_TEST
395 depends on OF
398 This will report PMIC junction over-temperature for one thermal trip
403 depends on ARCH_MEDIATEK || COMPILE_TEST
410 depends on OF && ARCH_MESON
419 depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
424 depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
430 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
431 depends on HAS_IOMEM
432 source "drivers/thermal/ti-soc-thermal/Kconfig"
436 depends on ARCH_EXYNOS || COMPILE_TEST
441 depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
451 depends on IIO
457 channel and converts it to temperature based on lookup table.
460 depends on (ARCH_QCOM && OF) || COMPILE_TEST
466 depends on ARCH_UNIPHIER || COMPILE_TEST
467 depends on THERMAL_OF && MFD_SYSCON
469 Enable this to plug in UniPhier on-chip PVT thermal driver into the
474 tristate "Temperature sensor on Spreadtrum SoCs"
475 depends on ARCH_SPRD || COMPILE_TEST
482 depends on OF
483 depends on MFD_KHADAS_MCU
488 by the Microcontroller found on the Khadas VIM boards.
491 tristate "Loongson-2 SoC series thermal driver"
492 depends on LOONGARCH || COMPILE_TEST
493 depends on OF
495 Support for Thermal driver found on Loongson-2 SoC series platforms.